SCINTIL Heterogeneous Integrated Photonics (SHIP™) technology
Silicon Photonics (SiPho) is constantly evolving, driven by data transmission requirements that demand improved speed (Gbps), power efficiency (pJ/bit), and efficient use of optical fibers (channels/fiber).
Traditional DFB lasers have been widely adopted to power optical transmissions in data centers due to their single-mode, mode-hop free operation and output power capability. Laser arrays have received considerable attention in recent years for their application in various DWDM systems.
However, realizing a DWDM DFB laser array remains very challenging because it requires precise control of the laser frequency spacing (e.g., ± 25 GHz on a 100 GHz grid). DFB laser frequencies are controlled by the grating period, and to achieve 100 GHz spacing, the period between the lasers must be adjusted by approximately 0.1 nm. Because SHIP™ leverages the performance of silicon photonics foundries, the DFB gratings can be precisely and repeatedly patterned in the silicon by deep UV photolithography and can be manufactured in volume.
Our unique BackSide-on-BOX approach enables the monolithic integration of silicon and InP/III-V materials. Unprocessed InP/III-V dies are bonded on the backside of processed wafers, only where it is needed. Our fabrication process is built on top of standard silicon-photonics process.
SHIP™ technology enable the fabrication of silicon photonic circuit with integrated DFB lasers, Si modulators, Ge-photodetectors, low loss SiN and Si waveguides.